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│Laser Job Shop Services│The materials│

 

 

We provide superior laser process in a wide range of materials from elements, compound/ alloy to multi-layers. Also we provide customers a cost- and time-efficient way for both mass production and small quantity prototype production.

 

1. Conductor

 


(Stainless steel drilling)


(Titanium slotting)

(Stainless slotting)

 

(Titanium drilling)

 

(Titanium cutting)

 

(Molybdenum cutting)

 

(Ferrocore cutting)

 

(Invar slotting)

 

(IV catheter needle slotting)

 

 

2. Semiconductor/ Compound Semiconductor

 
  • Silicon (Si)
  • Germanium (Ge)
  • AlAs
  • InP
  • Poly Silicon
  • Silicon Nitride
  • Silicon Dioxide
  • Silicon Carbide


(Silicon: cutting)


(Silicon: slotting)

(Silicon wafer slotting)

 

(Silicon wafer pattern removal)

 

(Silicon round die cutting)

 

(Ge wafer cutting)

 

(CdZnTe cutting)

 

 

 

3. Insulator

 
  • Diamond
  • CVD diamond
  • Quartz
  • Pyrex Glass
  • Ceramic
  • Polymer
  • Kapton
  • Sapphire
  • CBN

(CVD diamond drilling)

 

(Kapton drilling)

 

(Tungsten cardide drilling)

 

(Super conductor cutting)

 

4. Multi-layer

 
  • SOI Silicon on Insulator
  • SOC System on a chip

 

 

 


RUENTEX GROUP
TREND LASER TECHNOLOGY CO., LTD.

2Fl.-6, No. 8, Sec. 1, Jungshing Rd., Wugu Shiang, Taipei County, Taiwan 248, R. O. C.
TEL: +886-2-8976-9328                    FAX: +886-2-8976-9329
E-mail: sales@trendlaser.com