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- Biochip micro machining:
Micro channel and micro-hole drilling in the biochips.
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- Power semiconductor device:
Free-shape cutting, from rectangle, round, to hexogen, in the
chip of power semiconductor device.
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- Wafer downsizing:
Any patterned or un-patterned wafers can be downsized from
12"
to 8" or from 8" to 6". Wafer downsizing is applicable to wafer
reclaim, size change, etc.
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- Multi-project wafer dicing:
Dicing different-size chips in same wafer with laser, which
saves lots amounts of chip comparing with traditional diamond
saw cutting.
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- MEMS (Ink-jet printer head):
Slotting in the ink-jet printer head chip or hole drilling,
any-shape cutting and slotting in MEMS wafers.
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- Solar cell wafer:
Smooth cutting, non-linear cutting in the solar cell wafer.
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- Micro mold machining:
Micro mold machining of micro channel for opto-communication,
biochip, and MEMS.
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RUENTEX
GROUP
TREND LASER TECHNOLOGY CO., LTD.
2Fl.-6, No. 8, Sec. 1, Jungshing Rd., Wugu Shiang, Taipei County,
Taiwan 248, R. O. C.
TEL:
+886-2-8976-9328
FAX: +886-2-8976-9329
E-mail: sales@trendlaser.com |
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