Comparing with existing techniques and processes,
the state-of-the-art laser process technologies utilized by Trend
Laser Technology are equipped with the following advantages.
- No Heat Damage
- No Burr
- No Micro Crack
- No Thermal Stress
- No Chipping
- No Contamination
- No Mask needed
- No Post-Treatment needed
- Micron-grade Accuracy
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The following table shows the comparison of dicing by saw, which is
existing technology, and Trend Laser Technology's technology.
Comparison of Dicing by Saw and
TrendLaser's Technology
|
Abrasive
Sawing
|
TrendLaser's
Technology
|
| Dicing
Quality |
| Consistency in dicing
quality |
Variable because of blade
wear. |
Excellent because of consistent
light beam. |
| Chipping |
Yes |
No |
| Minimum kerf width |
25 micron |
5 micron |
| Fracture strength for
thin wafer |
Low |
High |
| Particle Contamination |
Moderate |
Low |
| Processing
Capabilities |
| Cutting |
Only straight cuts |
Multi-directional cuts |
| Scribing |
Only straight
lines |
Multi-directional
lines |
| Drilling |
Not possible |
Yes |
| Slotting |
Not possible |
Yes |
| Grooving |
Not possible |
Yes |
| Chip Geometries |
Only rectangular |
Any shapes |
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With dramatic enhancement of products' yield rate
and reduction in production cost, these advantages can synergize
our customers' superior competitive edges.
Moreover, to combine with Trend Laser Technology's specialized laser
process technology, our customers can accelerate their product development
processes to seize the best launch timing into the market.
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